ETSI releases new specification for embedded communication modules for M2M communications
ETSI’s Industry Specification Group (ISG) for Surface Mount Technique (SMT) has revealed its group specification for embedded communication modules for machine to machine (M2M) communications. Embedded communication modules based on surface mount technology offer many flexible, cost advantages across the manufacturing process, especially when it involves integrating communications functionality into a larger device or system.
ETSI’s specification for embedded communication modules, GS SMT 001, provides common physical specifications or form factors and common electrical characteristics for modules. These standards will enable the widespread adoption of common form factors, which will permit an easier transition to next-generation communication modules. It will also simplify the development of device vendors and offer a second source option for integrators.
Johan Zuidweg, Chairman of ISG SMT, believes these specifications will help clarify what the standards are for machine-to-machine communications across the entire market.
“Any Machine to Machine application, whether it be a tablet, eReader, personal health monitoring device or a smart utility meter, relies on a hardware module that provides 2G, 3G, or 4G connectivity. These modules must be very small and must withstand extreme temperatures, vibrations, or other physical conditions. As wireless devices proliferate, the market for such modules expands, and a specification was needed,” said Zuidweg.
The specification covers electrical and mechanical aspects that include, input-output (I/O) interfaces, their assignment to pads, pad placement, and module dimensions. This set of criteria also takes into account the environmental considerations, which affect electrical and mechanical aspects. The group specification covers the majority of use cases for embedded wireless modules. However, not every pad or function is fully characterized, which leaves room for customized flexibility and future functionalities. Module suppliers may select which interfaces, capabilities, and configuration they intend to supply, based on their market demand.
ETSI GS SMT 001 will advance economies of scale, and enable communication capabilities to be integrated into more devices and products. This process will become a critical enabler for the widespread adoption of machine to machine communications, leading to the Internet of Things (IoT).
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